Printed circuit board manufacturing - multilayer flexible circuit board
Manufacturing is possible from 3 layers to 8 layers. Thin materials and thin copper foil are used to ensure bendability.
We can manufacture from 3 layers to 8 layers. Typically, with multilayer flexible circuits, the more layers there are, the thicker the board becomes, which compromises the bendability that is a characteristic of flexible substrates. However, by using thin materials and thin copper foil, we ensure bendability. For more details, please contact us or refer to our catalog.
- Company：ケイツー
- Price：Other
